1. The plaintiff's claim is dismissed.

2. The costs of lawsuit shall be borne by the Plaintiff.

1. Facts of recognition;

A. The pertinent Plaintiff between the parties is a stock company established for the purpose of manufacturing semiconductors, ELCD and electronic equipment, manufacturing equipment, raw materials, and subsidiary materials (hereinafter “Plaintiff company”). The Defendant is a stock company established for the purpose of manufacturing and selling semiconductor parts (hereinafter “Defendant Company”).

B. The Defendant Company, which ordered the Plaintiff Company to supply semiconductor parts, requested the Plaintiff Company to supply semiconductor parts (Glas chacking parts) from C (automobile parts; hereinafter “original orders”) which is the customer of the Defendant Company, and consulted with the Plaintiff Company on May 15, 2017, and around May 22, 2017, the Defendant Company ordered the Plaintiff Company to combine semiconductor parts (Glas attached to upper ESC using static electricity within the head office room, and Glas attached to lower ESC; hereinafter “instant semiconductor parts”) under the following conditions. The Plaintiff Company ordered the Plaintiff Company to accept it (hereinafter “instant semiconductor parts”) (hereinafter “instant semiconductor parts”).

on May 24, 2017, the due date for payment of the item code SC 00301, the name ESS Chuk, the quantity 12 EA, the unit price of KRW 9,500,000, the supply price of KRW 125,400,00 (including value-added tax): Cash payment within 90,000,000: The supply price of at least three million is paid in cash within 90,000,000, and the down payment of the down payment of KRW 1EA on May 31, 201

C. After the process of supplying and returning semiconductor parts of the instant semiconductor parts of the Plaintiff Company, the process of supplying and returning semiconductor parts of the instant semiconductor parts between the Plaintiff Company and the Defendant Company is as follows.

Plaintiff

On May 27, 2017, the company returned semiconductor parts of the semiconductors of this case to the Defendant Company on or around May 28, 2017 and followed by the defects of the Defendant Company, the Plaintiff Company proceeded with A/S on the power failure and the A/S on the A/S on the A/S on the A/S of the A/Sspanish power failure, which occurred in part of the semiconductors of this case after the approval of high voltage was granted. On June 9, 2017, the Defendant Company re-supplys the semiconductors of this case to the Defendant Company to China.