1. The plaintiff's appeal is dismissed.

2. The costs of appeal shall be borne by the Plaintiff.

Purport of claim and appeal

The first instance court.

1. The reasoning of the court’s explanation concerning this case is as follows: (a) other than the addition of the following Paragraph (2) and Paragraph (3) of Article 8 of the Administrative Litigation Act and the main text of Article 420 of the Civil Procedure Act, citing the reasoning of the judgment of the court of first instance.

2. The addition;

(a)in addition to the following two lines of the fourth sentence of the first instance judgment, the following shall be added, and the third sentence shall add the "Evidence No. 24 of A" to the following "Evidence No. 6-1, 2 of the third sentence:

(f) The semiconductor manufacturing process is divided into a prefabricated process which enables a large number of waferers to prepare softs in high order, and is made in original form after putting them off in original form. The basic material processing process of semiconductor cattle and assembly process which combines wafers into individual chips, and the wafer processing process shall be (1) the spreading process which forms the real marction package on the surface of wafers, (2) the Position process which forms the circuit pattern on the surface of wafers, (3) the process of removing unnecessary parts through chemical reaction, etc. to complete the circuit pattern formed on the surface of wafers, and (5) the process of forming the chemical marcization or the chemical marcization process, (4) the process of forming the new marcization to the surface of wafers, etc.

B. The fourth 16 line of the judgment of the court of first instance is “Non Hogin” next to the “Non Dokin type”.