1. The part against the plaintiff in the judgment of the court of first instance shall be revoked.

2. The plaintiff's claim is dismissed.

2. The total cost of the lawsuit.

1. Details of the disposition;

A. On May 12, 1997, the network B (FFs; hereinafter “the network”) entered Samsung Electronic Co., Ltd. (hereinafter “Tsung”) and worked as a production worker in the inspection process of semiconductor assemblies at the E-workplace’s semiconductor assembly, and retired on July 15, 2003.

B. On May 4, 2010, the Deceased was diagnosed as brain species (mato-cell species) and claimed medical care benefits to the Defendant on July 23, 2010.

On February 7, 201, the Defendant issued a disposition not to grant medical care (hereinafter “instant disposition”) on the ground that it is difficult to recognize a proximate causal relationship between the above disease and the business on February 7, 201, following an individual epidemiological investigation by the Industrial Safety and Health Research Institute.

C. On April 7, 2011, the Deceased filed the instant lawsuit, and died of cerebral brain on May 7, 2012. As his spouse, C, a first-class bereaved family, took over the lawsuit.

[Reasons for Recognition] 1 to 4, 1 to 7, each entry of Gap evidence of No. 1 to 4, and 17, and the purport of the whole pleadings

2. Whether the instant disposition is lawful

A. The Plaintiff’s assertion was exposed to harmful substances, such as bee, sulphade, ethylenehyd, lead, multi-nuclear sulphe, and sulphal radiation, while working as a production worker in the inspection process at the Samsung E-Workplace, and the occurrence of cerebral suls in the state of chronic work and high-level labor strength, so a proximate causal relation should be acknowledged between the outbreak of such diseases and the work thereof.

(b) Entry in the attached Form of relevant Acts and subordinate statutes;

(c) Fact-finding 1) The contents of the inspection process carried out by the Deceased and the working environment (Bak Lap): Sawing the back of the waferer manufactured by bast to prevent damage to the processing process: Henbing off by scaming chips using a piece of semiconductor chips (chp): Hen- chips connected (Lead Frame): Wire chips.