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(영문) 서울행정법원 2014.05.01 2013구합60132
과징금부과처분취소
Text

1. All of the plaintiff's claims are dismissed.

2. The costs of the lawsuit, including those resulting from the participation, shall be all included.

Reasons

1. Details of the disposition;

A. The Intervenor joining the Defendant (hereinafter referred to as the “ Intervenor”) is a company engaged in the manufacturing of sound-explosive devices, such as singing-, ample-, Amplifier, etc.

B. The Intervenor developed a sound-explosion production technology, etc. using sound-explosion equipment production technology, etc. using electric flow different from electric flow, among those of the electric field effects franchiseistor, and semiconductors. In general, the Intervenor developed sound-explosion equipment production technology, etc.

The Intervenor applied the foregoing technology to the Intervenor’s trade secret, which was infringed upon by the Plaintiff, produced the Intervenor’s products and printed circuit board (“PCB, Printed Circard”), and exported them to Vietnam from 198.

In order to produce the above product, “data containing the Intervenor’s trade secrets” among the Intervenor’s trade secrets, “data containing the Intervenor’s trade secrets” is the same circuit map (referring to an electronic map that combines and connects various electronic parts using certain symbols. In the circuit map, the location number and capacity value of the electronic parts may be indicated and the circuit design may be carried out for the printed circuit board design to be completed) as indicated in the “data containing the Intervenor’s trade secrets” as indicated in the “data containing the Intervenor’s trade secrets.” The circuit map needs to be prepared by using the printed circuit design file (it is necessary to place and connect electronic parts in order to produce the printed circuit board based on the circuit map using the CAD (CAD, Common U.S.) program and the location and capacity of the electronic parts indicated in the design map (referring to the location and capacity of the electronic parts indicated in the drawing after designing the printed circuit).

The circuit map, a printed circuit design file, a part list, and a seal drawing.

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