1. The plaintiff's claim is dismissed.

2. The costs of lawsuit shall be borne by the Plaintiff.

1. Basic facts

A. The Plaintiff’s title of the instant patent invention (Evidence 3(1) of this case): The filing date of the semiconductor integrated system and the date of registration/registration number: the main contents of the invention on July 17, 2013 / June 26, 2015 / The main contents of the invention are as follows: (a) the background technology and solution of the invention; and (b) a new semiconductor material, including a compound semiconductor, to supplement or replace the previous practical container board.

Although semiconductors materials of these alternatives are of a kind of electrical nature, they have difficulties in themselves.

Therefore, the transition of more complicated materials is one of the main factors for the promotion of new manufacturing processes.

Therefore, even though the existing semiconductor manufacturing process has been fully satisfied in all respects, it was not proved that the existing semiconductor manufacturing process is fully satisfied.

(2) The main composition of the invention is generally related to the manufacture of ICT DNA. More detailedly, it is related to the formation of semiconductor/total system with traps density (inter-facetrare) [6]. For example, semiconductor materials, including 102) materials on board board (102) normally have a string structure as shown in 2 examples in Do Do 2. The main composition of the invention [112] on the surface (for example, 2] [12] on the surface (for example, 2] on the surface) of the machinery board (102) (hereinafter referred to as semiconductors), the molecule decision on the surface of the body body of the semiconductors of semiconductors is suspended, and the combination of non-surdying materials in semiconductors can be combined with non-surd. For example, 2012 or non-surted surface(s) on the surface(surd) on the surface) of the machinery board (102).

However, undecomposed non-degradation combinations.