1. The plaintiff's claim is dismissed.

2. The costs of lawsuit shall be borne by the Plaintiff.

1. Basic facts

(a) The name of the invention 1) invention of this case: 0 Doz. 20 Doz. 20 Doz. 20 Doz. 20 Doz. 10 Doz. 20 Doz. 20 Doz. 20 Doz. 20 Doz. 20 Doz. 207-2184 z. : 8/ 2007 z. 4) claims (as amended on June 19, 2013) 1 Doz. 1 Doz. 20 Doz. 20 Doz. 10 Doz. 20 Doz. 20 Doz. 20 Doz. 20 Doz. 20 Doz. 20 Doz. 20 Doz. 20 Doz. Doz. 20 Doz. 20 Doz.

B. Cited Invention 1) Cited Invention 1 is an invention as to “the method of manufacturing semiconductor devices and semiconductor devices” inserted in the Japanese Patent Gazette No. 2006-32888 (Evidence No. 5) published on February 2, 2006. 2) Cited Invention 2 is an invention as to “the semiconductor devices” published in the Japanese Patent Gazette No. 9-2341 (Evidence No. 6) published on September 5, 1997.

C. On February 19, 2013, the Korean Intellectual Property Office examiner: (a) on February 19, 2013, the invention claimed in the instant application to the Plaintiff is identical to the comparable invention 1; (b) a person who has no newness or has ordinary knowledge in the relevant technical field (hereinafter “ordinary engineer

The invention can be easily made from the cited inventions.