2. The costs of lawsuit shall be borne by the Plaintiff.

A. The status of the parties 1) G Co., Ltd. (the trade name at the time of its establishment was H, and thereafter, the trade name was changed to G Co., Ltd. on September 12, 2006 through J on March 25, 2009. < Amended by Act No. 11013, Oct. 31, 2011>

hereinafter referred to as "G"

(2) Defendant B served respectively as G’s representative director from September 12, 2006 to March 17, 2008, K, and Defendant C from September 12, 2006 to September 14, 2007, respectively, as G’s director, and Defendant D from September 12, 2006 to September 14, 2007.

3) Meanwhile, on July 25, 2008, K died, and Defendant E and F inherited the property of the network K. 4) G issued to L on February 25, 2011 a promissory note note 53 of the 2011, a notary public issued to L with a face value of one billion won per share, and issued a notarial deed No. 53 of the 2011, to which M acquired the above bill’s claim from L around June 201, and the Plaintiff acquired the above bill’s claim from M around November 7, 2014.

B. N Co., Ltd. N’s establishment and G takeover 1) The purpose of which is to manufacture, repair, or sell semiconductor equipment. Around August 2004, Samsung Electronic Co., Ltd., a major trading company, established a semiconductor company in the Chinese river basin, and it was manufactured by Samsung Electronic Co., Ltd. and foreign companies for the purpose of semiconductor failure projects manufactured by Samsung Electronic Co., Ltd. and foreign companies (hereinafter “P”).

1) Newly established (the semiconductor package refers to the conversion of semiconductor products into a pattern of a package, and it refers to the conversion of semiconductors into plastic or gold stuffs after cutting them into plastic or gold stuffs after cutting them, respectively, in order to protect persons from external shocks or electronic sources and to assign compatibility to semiconductors as parts.

[2] Since 2006, N continued the price of semiconductors.